3BHE015619R0001 ABB XVD825A01 UNITROL Excitation Systems Interface Board
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- Disconnect all primary rack power sources and apply lock-out tags before inserting or removing the module.
- Align the PCB edges strictly with the enclosure guide rails to prevent pin damage on the backplane connector.
- Tighten front panel mounting screws to achieve complete chassis ground bonding and resist ambient vibration.
- Route communications cables through separate conduit runs to maintain clear separation from high-voltage AC lines.
- Terminate all shielded cable ends at a single ground bus point to prevent circulating ground loops.
ABB 3BHE015619R0001 XVD825A01 Interface Board
Configured for high-speed signal routing and control isolation in UNITROL Excitation Systems platforms, the ABB 3BHE015619R0001, also cataloged as the XVD825A01 Interface Board, provides direct physical/electrical execution. Engineers integrate this hardware component into DCS architecture to handle deterministic data exchange across industrial drive loops and field control interfaces. The unit maintains stable board-level communications while isolated circuitry prevents electrical noise from degrading processing signals.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 3BHE015619R0001 XVD825A01 |
| Brand | ABB |
| Module Type | Interface Board |
| System Compatibility | DCS / UNITROL Excitation Systems |
| Communication Service | Ethernet Router / DeviceNet Digital I/O Gateway |
| Power Consumption | Standard backplane power allocation |
| Operating Temp | 0 to 60 deg C (standard industrial range) |
| Dimensions | 13.2 x 11.0 x 3.5 cm |
| Weight | 0.18 kg |
| Product Origin | Sweden |
| HS Code | 8537101190 |
| Coating | Normal Industrial Protective Coating |
| Status | Active |
Deterministic Backplane & Industrial Bus Performance
The module scales backplane communication speed while managing high-density signal distribution between processing units and external sub-bus topologies. By utilizing direct hardware routing, the board minimizes latency across DeviceNet digital I/O structures and Ethernet interface layers. Integrated firmware flash compatibility allows field engineers to update device protocols without altering physical wiring configurations. Channel-to-channel isolation safeguards sensitive digital paths against transient overvoltages, which preserves signal integrity under heavy electromagnetic interference.
Frequently Asked Questions
Q: How does the interface board manage signal processing across connected DeviceNet modules?
A: The onboard circuitry maps digital inputs directly to the backplane bus, so the main processor executes logic cycles without software conversions or added latency.
Q: What environmental protections shield this PCB card during continuous field operation?
A: A protective industrial coating covers the assembly to resist humidity, airborne contaminants, and thermal stress inside sealed DCS enclosures.
Q: Does replacing an existing XVD825A01 board require a total system shutdown?
A: Engineers must power down the specific sub-rack power bus before extraction because this interface module lacks hot-swap backplane decoupling features.
Field Installation Guidelines
| Weight | 0.18 kg |
|---|---|
| Country of Origin | Sweden |
| Dimension | 13.2 x 11 x 3.5 cm |











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