IC697MDL350 GE Automation 120V AC 32-Point Output Card

Product Overview

The GE Fanuc IC697MDL350 functions as a high-density discrete output module within the legacy Series 90-70 programmable logic controller system. This card controls industrial field devices by delivering reliable switching and robust overcurrent protection across thirty-two channels.

Technical Specifications

Key Technical Characteristics

The IC697MDL350 module optimizes control efficiency through its multi-group architecture. Mechanics isolate the thirty-two outputs into four distinct branches. Each branch contains eight individual channels. Because of this group isolation, engineers can supply power to each group from a different phase of the AC source.

Industrial environments demand resilience against electrical surges. Consequently, this module accommodates a high inrush current peak. The peak reaches twenty times the standard continuous rating. This thermal tolerance makes the card ideal for switching highly inductive loads. Such loads include industrial solenoids, heavy contactors, indicator panels, and motor starters.

The front bezel houses an extensive array of diagnostic indicators. Thirty-two individual LEDs show the logic-side on/off status of every output channel. Furthermore, four dedicated indicator lights immediately alert operators if any of the group fuses fail. Technicians access these internal fuses via the top surface of the module housing.

Configuration and System Integration

System integration requires minimal manual effort during setup. The hardware configuration process eliminates the need for physical jumpers or onboard DIP switches. Instead, technicians configure the system electronically. They define parameters using compatible Windows-based or legacy DOS software tools. The programming software establishes communication through SNP serial protocols or dedicated Ethernet TCP/IP network interfaces.

Mechanical keying on the backplane prevents incorrect card placement into the PLC rack. This feature ensures seamless hot-swapping and safeguards internal backplane components from voltage mismatch damage. The module design balances thermal dissipation across the circuit board. This balance helps maintain optimal current ratings during high-temperature conditions.