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51305072-400
HONEYWELL
T/T
1 year
| Availability: | |
|---|---|
| Quantity: | |
Description
Packaging stresses associated with assembling a sensor to a next level PCB assembly should be addressed in the final assembly design. Ensure adherence to the following precautions: • Use ”keep out” areas at the end-ofline test probe locations. Avoid probe location around or directly on the opposite side of the sensor. Using test probes in the wrong locations may affect sensor output. • Survey all end-of-line test systems to understand the maximum microstrain exerted on the sensor/PCB assembly. Honeywell recommends that strain on each assembly does not exceed 500 µstrain. • Address sensor orientation sensitivity. • Do not screw down or heat stake the PCB assembly near the sensor. Ensure screw and heat staking locations do not exert excessive force in, around, or directly on the opposite side of the sensor. Excessive screw or heat staking force may affect sensor output. • Do not use ultrasonic cleaning. The frequencies used may damage wire bond interconnections. • Consider using singulation processes such as PCB assembly depaneling/ sawing with a sensor to understand the maximum strain exerted on the sensor/PCB assembly. Honeywell recommends that strain on each assembly does not exceed 500 µstrain. Table 4 provides several diagnostic tools that may be used for process debug and final disposition of the SMT soldering process.
Honeywell Main Products
| 8C-TAOXB1 | CC-PDOB01 | 6172040508 |
| CC-PAIN01 | TC-OAV081 | 9910150046 |
| 8C-PAIMA1 | TC-PRR021 | 9910150075 |
| CC-PDIL01 | MC-PAIH03 | 9910150087 |
| CC-PAIM01 | FC-PSU-240516 | 9910160020 |
| 8C-PAOHA1 | FC-TSAI-1620M | 51309288-125 |
| TC-OAV081 | FS-16DI-RL | 51304754-150 |
Our Supply Range
1.Allen-Bradley1756/1769/1771/1785Series (1769-L30ERMS,1769-L30ER-NSE,1769-L33ERMS,1756-L61,1756-L62,1756-L73）
2. ABB 800xA/Bailey INFI90/DSQC/ Series (07KT98 WT98,07KT97 WT97,DSQC679,IMASI23,IMDSO14...)
3. Bently Nevada 3500/3300 Series (3500/42M ,3500/22M,3500/95.3500/15)
4. Schneider Modicon Series (140CPU65150,140CPU67060,140CRA ,140CPS)
5. GE IC693/IC697/IC698/IS200/DS200 Series (IC693CPU363,IC697PWR711,369-HI-0-0-0-0,DS200ADGIH1AA)
6. SIEMENS MOORE/S5 Series (6ES7 cards,6ES5,6DD,6DP)
7. Westinghouse/OVATION (1C31194G01,1C31197G01,5X00106G01,1C31125G02...)
8. ROSEMOUNT: (3008,3664,3805E.3704E,3700A 4351B...)
9. FOXBORO (FCP270,FBM203,FBM204,FBM217,FMB231...)
You Might be Interested
| MC-TAIL02 | IS200STAIH2ACB | NTDI01 | 5X00070G04 |
| MC-TAMR03 | DS200LDCCH1AGA | SPDSO14 | 1C31116G04 |
| MC-TLPA02 | IC698CPE010-CC | SPASO11 | 5X00106G01 |
| MC-TAOY22 | IC200ALG260B | SPNIS21 | 5X00109G01 |
| MC-TAMT03 | IC200ALG260C | SPDSI14 | 1C31189G01 |
| TC-IAH16I | IC200ALG320C | SPNPM22 | 1C31219G01 |
| TC-PRS021 | IC200ALG320H | SPFEC12 | 1C31223G01 |
| 8C-TAIXA1 | IC200MDL640K | IMASO11 | 1C31192G01 |
| 8C-TAOXB1 | IC200MDL740D | SPBRC300 | 1X00030H01 |
| CC-PAIN01 | IC200MDL740H | INNPM12 | 1X00030H02 |
| 8C-PAIMA1 | IC693ALG223 | IMHSS03 | 1X00030H03 |
| CC-PDIL01 | IC200CHS002L | NTAI05 | 1X00030H04 |
FAQ
1.Is the part new?
Yes, 100% Original brand new
2.How is the package?
Original factory seal packed
3.What is the lead time?
In stock: 1-3 working days
4.What is the MOQ:
1pcs
5.What is the payment term:
T/T
6.What is the warranty time?
One year
Why You Choose Us
Inventory: A wide range of new and discontinued parts for a wide range of labels.
Reliable: Each product is tested.
Speed: Fast response and efficient delivery.
Professional: Solid business organization.
International: A network of global partners and preferred suppliers.
Our company's products include distributed control system (DCS), programmable logic controller (PLC), MOTOROLA MVME industrial mode Industrial Control Communications Converters, Remote Output / Input Modules, Industrial Computers (IPC), Human Interface.
Main business: AB, ABB, GE, Bently Nevada-Bentley, Honeywell, ICS Triplex, Siemens, Yokogawa, Woodward, Emerson, EPRO, Fuji, Invensys Triconex has abundant stock, fast delivery, reliable quality, and good prices.
Description
Packaging stresses associated with assembling a sensor to a next level PCB assembly should be addressed in the final assembly design. Ensure adherence to the following precautions: • Use ”keep out” areas at the end-ofline test probe locations. Avoid probe location around or directly on the opposite side of the sensor. Using test probes in the wrong locations may affect sensor output. • Survey all end-of-line test systems to understand the maximum microstrain exerted on the sensor/PCB assembly. Honeywell recommends that strain on each assembly does not exceed 500 µstrain. • Address sensor orientation sensitivity. • Do not screw down or heat stake the PCB assembly near the sensor. Ensure screw and heat staking locations do not exert excessive force in, around, or directly on the opposite side of the sensor. Excessive screw or heat staking force may affect sensor output. • Do not use ultrasonic cleaning. The frequencies used may damage wire bond interconnections. • Consider using singulation processes such as PCB assembly depaneling/ sawing with a sensor to understand the maximum strain exerted on the sensor/PCB assembly. Honeywell recommends that strain on each assembly does not exceed 500 µstrain. Table 4 provides several diagnostic tools that may be used for process debug and final disposition of the SMT soldering process.
Honeywell Main Products
| 8C-TAOXB1 | CC-PDOB01 | 6172040508 |
| CC-PAIN01 | TC-OAV081 | 9910150046 |
| 8C-PAIMA1 | TC-PRR021 | 9910150075 |
| CC-PDIL01 | MC-PAIH03 | 9910150087 |
| CC-PAIM01 | FC-PSU-240516 | 9910160020 |
| 8C-PAOHA1 | FC-TSAI-1620M | 51309288-125 |
| TC-OAV081 | FS-16DI-RL | 51304754-150 |
Our Supply Range
1.Allen-Bradley1756/1769/1771/1785Series (1769-L30ERMS,1769-L30ER-NSE,1769-L33ERMS,1756-L61,1756-L62,1756-L73）
2. ABB 800xA/Bailey INFI90/DSQC/ Series (07KT98 WT98,07KT97 WT97,DSQC679,IMASI23,IMDSO14...)
3. Bently Nevada 3500/3300 Series (3500/42M ,3500/22M,3500/95.3500/15)
4. Schneider Modicon Series (140CPU65150,140CPU67060,140CRA ,140CPS)
5. GE IC693/IC697/IC698/IS200/DS200 Series (IC693CPU363,IC697PWR711,369-HI-0-0-0-0,DS200ADGIH1AA)
6. SIEMENS MOORE/S5 Series (6ES7 cards,6ES5,6DD,6DP)
7. Westinghouse/OVATION (1C31194G01,1C31197G01,5X00106G01,1C31125G02...)
8. ROSEMOUNT: (3008,3664,3805E.3704E,3700A 4351B...)
9. FOXBORO (FCP270,FBM203,FBM204,FBM217,FMB231...)
You Might be Interested
| MC-TAIL02 | IS200STAIH2ACB | NTDI01 | 5X00070G04 |
| MC-TAMR03 | DS200LDCCH1AGA | SPDSO14 | 1C31116G04 |
| MC-TLPA02 | IC698CPE010-CC | SPASO11 | 5X00106G01 |
| MC-TAOY22 | IC200ALG260B | SPNIS21 | 5X00109G01 |
| MC-TAMT03 | IC200ALG260C | SPDSI14 | 1C31189G01 |
| TC-IAH16I | IC200ALG320C | SPNPM22 | 1C31219G01 |
| TC-PRS021 | IC200ALG320H | SPFEC12 | 1C31223G01 |
| 8C-TAIXA1 | IC200MDL640K | IMASO11 | 1C31192G01 |
| 8C-TAOXB1 | IC200MDL740D | SPBRC300 | 1X00030H01 |
| CC-PAIN01 | IC200MDL740H | INNPM12 | 1X00030H02 |
| 8C-PAIMA1 | IC693ALG223 | IMHSS03 | 1X00030H03 |
| CC-PDIL01 | IC200CHS002L | NTAI05 | 1X00030H04 |
FAQ
1.Is the part new?
Yes, 100% Original brand new
2.How is the package?
Original factory seal packed
3.What is the lead time?
In stock: 1-3 working days
4.What is the MOQ:
1pcs
5.What is the payment term:
T/T
6.What is the warranty time?
One year
Why You Choose Us
Inventory: A wide range of new and discontinued parts for a wide range of labels.
Reliable: Each product is tested.
Speed: Fast response and efficient delivery.
Professional: Solid business organization.
International: A network of global partners and preferred suppliers.
Our company's products include distributed control system (DCS), programmable logic controller (PLC), MOTOROLA MVME industrial mode Industrial Control Communications Converters, Remote Output / Input Modules, Industrial Computers (IPC), Human Interface.
Main business: AB, ABB, GE, Bently Nevada-Bentley, Honeywell, ICS Triplex, Siemens, Yokogawa, Woodward, Emerson, EPRO, Fuji, Invensys Triconex has abundant stock, fast delivery, reliable quality, and good prices.
